PRIME H310M-E R2.0｜Motherboards｜ASUS Indonesia

Temperature and humidity tests

Ensures components withstand extreme conditions.

Thermal measurement tests

Ensures that the system remains cool and stable under the heaviest loads.

Insertion tests

Every port and connector is put through repeated installation cycles.

Aging tests

Up to 48-hour aging test ensures reliability.

Power-consumption tests

Delivers world-class energy efficiency.

Temperature and DC margin tests

Ensures that the motherboard is capable of coping with voltages fluctuations caused by varying temperatures.

Thermal-shock tests

Ensures ability to survive temperature changes during transportation.

Non-operation shock tests

Built to withstand jolts that may occur during shipping.

Burn-in tests

Every component is checked to ensure flawless operation.

Installation tests

Connector placement is double-checked to ensure hassle-free installation.

Drop tests

Drop tests from various heights ensure durability.

Salt and spray tests

Tested for I/O reliability, prolonged lifespan and rust-resistance.